Tuesday, May 31, 2016

MEMS industry Group -- MicroVision Feature

Thanks Phil!

MEMS & Sensors Events

Jari Honkanen, Director of Technical Marketing and Applications Development, MicroVision, Inc.

Jari Honkanen
Biography coming soon!

MEMS Laser Scanning: Platform for Next Generation 3D Depth Sensors

MicroVision’s MEMS Laser Beam Scanning (LBS) technology is a leading display technology for pico projection, heads-up-display, and augmented reality eyewear applications. The same flexible technology can also be applied to exciting new sensing applications, such as 3D depth sensing. Demand for small and low cost 3D depth sensing solutions is growing rapidly driven by increasing demand for new approaches for Natural User Interface, Machine Vision, Robotic Navigation, Metrology, and Advanced Driver Assistance System. This session will compare the existing 3D depth sensor solutions based on stereo cameras, structured light and 3D CMOS Cameras. It will then present a new MEMS Laser Scanning based depth sensor platform solution that will enable new generation of tiny 3D depth sensors with new capabilities such as dynamic variable resolution and variable acquisition speed. These dynamic scanning MEMS based depth sensors can become an enabling technology for a completely new set of innovative products and applications for years to come.

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