LED Inside
LEDinside has researched on the supply chain of 3D sensing, and points out that algorithm, emission pattern and patent will be the three key elements for 3D sensing development in the future. VCSEL/EEL wafer and chip foundries (e.g. IQE, VPEC, Win Semi, II-VI, Epistar, HLJ, AWSC) have increased their production capacity. Major VCSEL/EEL packaging companies include Lumentum, Finisar, Princeton Optronics, NeoPhotonics, Philips Photonics, OSRAM OS. As for different algorithms, PrimeSense, Mantis Vision, Qualcomm/Himax, Intel, etc. now focus on structured light technology, and STMicroelectronics, Google/Infineon/pmd, MicroVision, Orbbec, etc. use ToF technology. Apart from Apple, Samsung and ASUS, Chinese smartphone brands like Xiaomi, Lenovo, Huawei and OPPO, etc all plan to release new phones with 3D sensing,
LEDinside has researched on the supply chain of 3D sensing, and points out that algorithm, emission pattern and patent will be the three key elements for 3D sensing development in the future. VCSEL/EEL wafer and chip foundries (e.g. IQE, VPEC, Win Semi, II-VI, Epistar, HLJ, AWSC) have increased their production capacity. Major VCSEL/EEL packaging companies include Lumentum, Finisar, Princeton Optronics, NeoPhotonics, Philips Photonics, OSRAM OS. As for different algorithms, PrimeSense, Mantis Vision, Qualcomm/Himax, Intel, etc. now focus on structured light technology, and STMicroelectronics, Google/Infineon/pmd, MicroVision, Orbbec, etc. use ToF technology. Apart from Apple, Samsung and ASUS, Chinese smartphone brands like Xiaomi, Lenovo, Huawei and OPPO, etc all plan to release new phones with 3D sensing,
Smartphone brands are now deploying in the market and seeking for cooperation within the supply chain. But obstacles still remain for future development of 3D sensing market, including obtaining patents, developing third-party application, and increasing the performance-price ratio.
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